PCB Manufacturing Checklist

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Before placing your order:

Check that:

• All connections in your schematic are present
• Inappropriate connections are not made including short-circuits.
• Review the Edit Nets Dialog.
• Job | Analyze was used to resolve any errors.
• View each layer separately and all together.
• Silk screen overlap with pads is not present.
• Job | Settings - check all settings.
• Job | Parts List - check all fields.
• All footprints have entries in Job | Parts List.
• Unambiguous device orientation is shown on silk screen per markings on the device. Diode cathodes are on the pad next to the silk screen dot or line. DIP IC pin 1 is near the silk screen semi-circle. Quad IC pin 1 is near the silk screen beveled corner.
• Uniform orientation is made for ICs and other polarized devices to reduce assembly errors.
• Component packages don't overlap.
• Copper footprints exceed component leads to allow inspection of solder joint.
• If you plan to make a custom enclosure at eMachineShop, first export your layout to DXF to verify alignment.
• Assembly by Pad2Pad is per "standard" Capabilities.

It is also recommended to check that:

• Traces width is at least .008".
• Hole diameter is at least .015".
• Silk screen line width is at least .008" wide.
• Edge gaps between copper and board edge are at least .020" for V-scoring or .060" for tab-routing or .010" for Individual routing.
• Pads are unmasked at those made with Polygon or Circle tool.
• Four layer boards - select View | layers... Set checkmark next to "1st inner" and "2nd inner" to open a four-layer view and see  the inner layers.  Use the Window menu to select the original view or just close the layers dialog.

No checklist is 100% complete and must not be taken as a substitute for careful work.

Once you have thoroughly checked your design, you are ready for ordering.

Upon receiving your boards it is strongly recommended to:

• Test or at least visually inspect the bare boards (four layer boards must be electrically tested).
• Assemble and test one board before assembling all boards.
• Test a board alone prior to placing the board into a system.