Before placing your order:
Use your circuit schematic to check that:
- All connections are present
- No inappropriate connections are made including short-circuits.
If you used nets while routing the board (highly recommended):
- Check nets in the Edit Nets Dialog.
From the main menu:
- Choose Job | Analyze and resolve any errors.
- Traces are at least .008" wide.
- Holes are at least .015" diameter.
- Silk screen lines are at least .008" wide.
- Gaps between copper and edge of board are at least .020" for V-scoring or .060" for tab-routing or .010" for Individual routing.
- Pads made with the Polygon or Circle tool are unmasked.
- For four layer boards select View | Inner layers... Use the Top and Bottom layers to see the top and bottom inner layers in this view. Use the Window menu to select the original view.
For component assembly check that:
- IMPORTANT: The orientation of all devices must be unambiguous from the markings on the device and the marking on the component - change the silk screen layer to clarify. Ideally, on the silk screen use the same dots, lines etc. that appear on the component itself.
- Make sure the orientation of text on components is the same as on the silk screen.
- Diode cathodes are on the pad next to the silk screen dot.
- DIP IC pin 1 is near the silk screen semi-circle.
- Quad IC pin 1 is near the silk screen beveled corner.
- Ideally all ICs and other polarized devices are oriented the same way as each other to reduce assembly errors.
- Component packages will not overlap.
- Copper footprints are at least .015 larger than component package / leads to allow inspection of solder joint.
- For component assembly by Pad2Pad check that assembly is per our "standard" Capabilities.
Once you have thoroughly checked your design, you are ready for ordering.
Upon receiving your boards it is strongly recommended to:
- Test or at least visually inspect the bare boards (four layer boards must be electrically tested).
- Assemble and test one board before assembling all boards.
- Test a board alone prior to placing the board into a system.
